GFPURE is one of the very few companies in the world capable of launching boron removal CEDI, which is mainly designed for high-end semiconductor industry applications, using targeted design of ionic membrane and resin encapsulation technology, silicon and boron leakage control at an excellent level, can replace the traditional ordinary mixed bed and ordinary CEDI, greatly improve the service life of the finishing system. Reduce system operating costs. It is an upgrade to the GFPURE UPW series of CEDI products and also incorporates GFPURE's patented technologies.

UPW-B semiconductro grade boron removal CEDI module

The anode is coated with platinum and designed with a lifespan of ≥10 years

UPW-B series features

Specially designed ion exchange membranes for silicon and boron removal

Secondary glue injection to double O-ring sealing technology, prevent leakage

Patented stepped water distribution technology with excellent single chamber exchange rate

PARAMETER

DC Voltage(V,DC)

0-500

Sodium ion(Na+) Removal Rate

Silicon(SiO2) Removal Rate

(include CO2 and Si)

Suggest Feed PH

Product Resistivity(MΩ.cm)

Flow Rate(L/H)

>99%

>99%

<10us/cm

7.5-9.0

≥ 17

Maximum:5000L

>99%

Chloride(CL-) Removal Rate

Polar Water Flow(L/H)

Recovery Rate(%)

Operating Temperature(°F)

TOC Removal Rate

Boron Removal Rate

DC Amperage(A,DC)

90-95

41-113

>95%

>99%

1.0-6.0

80-120L

Minimum:1000L

Feed Equivalent Conductivity

Secondary RO Product Water

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