GFPURE is one of the very few companies in the world capable of launching boron removal CEDI, which is mainly designed for high-end semiconductor industry applications, using targeted design of ionic membrane and resin encapsulation technology, silicon and boron leakage control at an excellent level, can replace the traditional ordinary mixed bed and ordinary CEDI, greatly improve the service life of the finishing system. Reduce system operating costs. It is an upgrade to the GFPURE UPW series of CEDI products and also incorporates GFPURE's patented technologies.
UPW-B semiconductro grade boron removal CEDI module
The anode is coated with platinum and designed with a lifespan of ≥10 years
UPW-B series features
Specially designed ion exchange membranes for silicon and boron removal
Secondary glue injection to double O-ring sealing technology, prevent leakage
Patented stepped water distribution technology with excellent single chamber exchange rate
PARAMETER
DC Voltage(V,DC)
0-500
Sodium ion(Na+) Removal Rate
Silicon(SiO2) Removal Rate
(include CO2 and Si)
Suggest Feed PH
Product Resistivity(MΩ.cm)
Flow Rate(L/H)
>99%
>99%
<10us/cm
7.5-9.0
≥ 17
Maximum:5000L
>99%
Chloride(CL-) Removal Rate
Polar Water Flow(L/H)
Recovery Rate(%)
Operating Temperature(°F)
TOC Removal Rate
Boron Removal Rate
DC Amperage(A,DC)
90-95
41-113
>95%
>99%
1.0-6.0
80-120L
Minimum:1000L
Feed Equivalent Conductivity
Secondary RO Product Water
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CEDI (Continuous Electrodeionization)
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